APA引文

Low, P. L. (2019). Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng.

Chicago Style Citation

Low, Pui Leng. Curing Characterization of Pressureless Sintered Die Attach Material As Leadfree Salution in Microelectronics Packaging / Low Pui Leng. 2019.

MLA引文

Low, Pui Leng. Curing Characterization of Pressureless Sintered Die Attach Material As Leadfree Salution in Microelectronics Packaging / Low Pui Leng. 2019.

警告：这些引文格式不一定是100％准确.