Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng

• 第一著者: Low, Pui Leng
• フォーマット: 学位論文
• 出版事項: 2019
• 主題: TJ Mechanical engineering and machinery
• オンライン･アクセス: http://studentsrepo.um.edu.my/11482/1/Low_Pui_Leng.jpg; http://studentsrepo.um.edu.my/11482/6/pui_leng.pdf; http://studentsrepo.um.edu.my/11482/

Tin-silver solder alloy is widely accepted as Pb-free alternative in power electronics. However, this solder alloy cannot meet the requirements of next generation industrial and automotive power drive systems. With the ever-increasing demand for wide bandgap semiconductors with junction temperature...